Lyra733 / Lyra733N Nitrogen SMT Reflow Oven
I.C.T Lyra Series
High-throughput Nitrogen SMT Reflow Oven for lead-free SMT production. Lyra733 / Lyra733N combines 10 heating zones, precise rail transport, and controlled reflow oven nitrogen performance.
- 10 heating zones with 3730mm heating length
- 3 cooling zones for controlled post-peak cooling
- Lyra733N nitrogen support with peak-zone oxygen below 500ppm
- 50-460mm standard rail range, plus wide rail and dual-rail choices
- PC + Siemens PLC platform for recipe, alarm, and data management
Nitrogen SMT Reflow Oven Technical Data
Lyra733 and Lyra733N share the same 10-heating-zone high-end process platform, with 3 cooling zones handled separately after peak soldering. Buyers comparing a 10 Zones SMT Reflow Oven can use Lyra733 when they need a 3730mm heating section, larger throughput, and stronger lead-free profile control. The N model is configured for nitrogen production, while the standard 50-460mm rail range supports most SMT PCB requirements. If your team asks how much nitrogen is used in reflow oven production, I.C.T can calculate the usage from PCB width, throughput, and target oxygen level.
| Item | Lyra733 | Lyra733N |
|---|---|---|
| Machine dimension | 6250 × 1400 × 1500mm | 6250 × 1400 × 1500mm |
| Weight | Approx. 3000kg | Approx. 3200kg |
| Heating zone length | 3730mm | 3730mm |
| Heating / cooling zones | 7 preheating + 3 peak heating; 3 cooling | 7 preheating + 3 peak heating; 3 cooling |
| Maximum soldering temperature | Preheating zones 300°C, peak zones 350°C | Preheating zones 300°C, peak zones 350°C |
| Warm-up time | Approx. 20 minutes | Approx. 20 minutes |
| Rail width | Single rail 50-460mm; optional 50-686mm or custom width; dual rail 50-290mm × 2 | Single rail 50-460mm; optional 50-686mm or custom width; dual rail 50-290mm × 2 |
| Conveyor speed | 300-1800mm/min | 300-1800mm/min |
| Peak-zone oxygen | Air process or nitrogen-ready foundation | <500ppm under nitrogen process conditions |
| Connected / operating load | 75kW / 12kW | 80kW / 12kW |
Final configuration can change with rail options, nitrogen control, cooling requirements, voltage, and project layout. Use the approved I.C.T proposal as the final reference.
SMT Reflow Oven Machine For Higher Throughput
Lyra733 is positioned for factories that have outgrown compact reflow capacity and need a longer, more forgiving SMT reflow oven machine for continuous production. Its 3730mm heating section gives process engineers more room to control ramp, soak, peak, and cooling behavior without jumping to the largest Lyra footprint.
When a standard Lead-free SMT Oven begins to limit throughput or profile margin, Lyra733 provides a stronger nitrogen-capable platform for communication boards, automotive electronics, power modules, appliance controls, LED assemblies, and mixed-product SMT lines.
Lead-Free SMT Oven Process Control
For Lyra733, the value is not only the longer oven body. The 7 preheating zones, 3 peak heating zones, 3 separate cooling zones, and nitrogen-ready chamber work together to give engineers more adjustment space when product size, thermal mass, or line speed changes.
10 Heating Zone Process Margin
The longer chamber supports smoother thermal transitions for boards that need more heating time than compact ovens can provide.
Throughput Upgrade Path
Lyra733 suits SMT lines where production volume is rising but the factory still needs controlled power, footprint, and profile stability.
Nitrogen Process Planning
The Lyra733N configuration supports low-oxygen soldering while keeping nitrogen use tied to PCB width, gap, and actual throughput.
Lyra733 Reflow Oven Nitrogen Features
Nitrogen Recycling For Longer Lines
Lyra733N is built for factories that need nitrogen coverage across a longer process chamber. The sealed body, inlet and outlet recycling design, and process detection ports help keep oxygen control practical during continuous SMT production.
- Peak-zone oxygen target below 500ppm under nitrogen conditions
- Approx. 30m3/h reference nitrogen use for listed single-conveyor conditions
- Cooling-zone nitrogen protection supports process continuity
Flexible Transport For Production Growth
Lyra733 can support single rail, optional wider rail, and dual-rail planning for factories that expect product mix changes. This is important when a line must handle wider PCB formats today and leave room for future lane or carrier changes.
- Single rail 50-460mm as standard, with wider rail options
- Dual rail 50-290mm x 2 for suitable line layouts
- Stable 300-1800mm/min speed adjustment for profile tuning
Plate Nozzle Heat Transfer
The 10-heating-zone architecture gives Lyra733 more process resolution than compact ovens, while the optimized plate nozzle design helps transfer heat evenly across the PCB. This combination is useful when higher line speed still requires reliable wetting and thermal balance.
- 7 preheating zones and 3 peak zones for profile shaping
- Peak zones rated up to 350°C for lead-free soldering
- Forced convection supports repeatable board-to-board heating
Thermal Profile Margin For Throughput
Lyra733 gives process engineers a broader adjustment window when the production line moves between light boards, dense assemblies, and mixed thermal loads. The thermal profile image helps customers understand how the oven supports stable peak control and repeatable soldering results.
- Useful for high-mix SMT production and profile changeover
- Supports lead-free ramp, soak, peak, and cooling analysis
- Helps reduce insufficient wetting and profile drift risk
Production Data And PLC Control
For a longer reflow oven, clear control and traceable data become more important. Lyra733 combines PC operation with Siemens PLC control so operators can manage recipes, alarms, process records, and profile work in a more organized way.
- Recipe and profile management for repeated production
- Operation records support shift and product traceability
- Fault self-diagnosis helps reduce maintenance response time
Send Your Inquiry
Send the PCB size, expected UPH, solder paste type, oxygen target, and line layout. I.C.T will confirm whether Lyra733 or Lyra733N is the better fit.
Related SMT Reflow Oven Machine Models
Lyra733 is the higher-throughput Lyra choice. The models below give customers different directions for standard lead-free production, smaller-line budgets, or vacuum void control.
Factory Support And Project Service
For Lyra733 projects, I.C.T reviews the production target before confirming the oven. The support team can discuss line speed, PCB width, nitrogen consumption, exhaust planning, cooling water conditions, and upstream or downstream SMT equipment connection.
Before delivery, the machine can be checked around heating response, conveyor movement, control functions, alarm logic, electrical safety, and ordered options. This gives the customer a clearer startup path when the equipment reaches the factory.
I.C.T Project Capability
Lyra733 buyers usually need more than a machine quotation. This process view shows how I.C.T handles technical review, production, testing, delivery, and compliance proof before the equipment enters the SMT line.
Equipment R&D
Process and layout requirements are reviewed before the Lyra733 proposal is fixed.
Equipment Production
Workshop assembly follows the confirmed configuration, options, and project schedule.
Testing And Aging
Heating response, transport motion, controls, and alarms are checked before shipment.
Factory Service Delivery
Delivery support covers installation, training, profile setup, and production startup.
Certificate Display
Certificate files and quality records help customers complete internal approval.
Reflow Oven Nitrogen FAQ
Use these questions to check whether Lyra733 matches your line speed, PCB width, nitrogen target, and lead-free soldering process before sending the inquiry.
What is the difference between Lyra733 and Lyra733N?
Lyra733 is the air-process base model for the 10-heating-zone Lyra platform. Lyra733N adds the nitrogen process configuration for customers who need lower oxygen in the soldering area, with peak-zone oxygen designed below 500ppm under suitable operating conditions.
Is Lyra733 a 10 Zones SMT Reflow Oven?
Yes. Lyra733 is a 10 Zones SMT Reflow Oven when counting heating zones: 7 preheating zones and 3 peak heating zones. It also has 3 cooling zones after soldering, with a 3730mm heating section for wider profile control.
When should I choose a Nitrogen SMT Reflow Oven?
Choose a Nitrogen SMT Reflow Oven when solder wetting, oxidation control, fine-pitch components, or high-reliability assemblies make normal air reflow difficult to control. It is most useful when the project has a defined oxygen target or solder joint reliability requirement.
What PCB width does Lyra733 support?
The standard single rail range is 50-460mm. If the line needs larger products or special carriers, the rail can be configured to 50-686mm or another project-specific width. Dual rail can be planned at 50-290mm times 2.
Can Lyra733 be used for lead-free SMT production?
Yes. Lyra733 supports lead-free SMT soldering with preheating zones up to 300°C and peak zones up to 350°C. The longer heating length gives engineers more room to tune a stable lead-free profile.
How much nitrogen is used in reflow oven production?
For Lyra733, the PDF reference lists approx. 30m3/h under single-conveyor conditions below 1000ppm in the peak zone, based on max. PCB width 200mm and PCB gap 50mm. With N2-control in standby mode at 200mm transport width, the reference value is approx. 27m3/h. Final usage depends on PCB width, throughput, oxygen target, and factory airflow.
Can I.C.T support Lyra733 profile setup?
Yes. I.C.T can help review the PCB, solder paste, target line speed, and component mix, then support profile setup, operator training, startup checks, and later process adjustment when products change.