Lyra622 / Lyra622N Nitrogen Reflow Oven
I.C.T Lyra Series
Compact SMT PCB Nitrogen Reflow Oven for stable lead-free SMT production. Lyra622 / Lyra622N combines 8 heating zones, precise rail transport, and optional nitrogen process control.
- 8 heating zones with 3030mm heating length
- 2 cooling zones for controlled post-peak cooling
- Lyra622N nitrogen support with peak-zone oxygen below 500ppm
- Single rail width 50-460mm, with wider and dual-rail options
- PC + Siemens PLC control with profile and process data support
Reflow Oven 450mm Width PCB Technical Data
Lyra622 and Lyra622N share the same compact 8-heating-zone process platform, with 2 cooling zones handled separately after peak soldering. The N model is configured for nitrogen production, with added weight and connected load related to the nitrogen process configuration. The standard 50-460mm rail range also supports buyers evaluating a reflow oven 450mm width PCB application.
| Item | Lyra622 | Lyra622N |
|---|---|---|
| Machine dimension | 5150 × 1400 × 1500mm | 5150 × 1400 × 1500mm |
| Weight | Approx. 2400kg | Approx. 2600kg |
| Heating zone length | 3030mm | 3030mm |
| Heating / cooling zones | 6 preheating + 2 peak heating; 2 cooling | 6 preheating + 2 peak heating; 2 cooling |
| Maximum soldering temperature | Preheating zones 300°C, peak zones 350°C | Preheating zones 300°C, peak zones 350°C |
| Warm-up time | Approx. 20 minutes | Approx. 20 minutes |
| Rail width | Single rail 50-460mm; optional 50-686mm or custom width; dual rail 50-290mm × 2 | Single rail 50-460mm; optional 50-686mm or custom width; dual rail 50-290mm × 2 |
| Conveyor speed | 300-1800mm/min | 300-1800mm/min |
| Peak-zone oxygen | Air process or nitrogen-ready foundation | <500ppm under nitrogen process conditions |
| Connected / operating load | 59kW / 10kW | 62kW / 10kW |
Specifications may be adjusted with equipment upgrades and project configuration. Final data should follow the confirmed I.C.T technical proposal.
Compact SMT PCB Nitrogen Reflow Oven
Lyra622 is used when a factory needs a more stable SMT Reflow Oven than a basic hot air machine, but does not need the larger footprint of Lyra733 or Lyra933. It is suitable for electronics manufacturers producing communication boards, automotive modules, industrial controls, home appliance PCBs, LED products, and other lead-free SMT assemblies.
For factories moving from standard reflow equipment to a more controlled nitrogen-capable platform, Lyra622 gives a stronger process window. The machine helps engineers manage solder paste melting, wetting, oxidation control, thermal balance, cooling behavior, and process repeatability in one continuous line.
Lead-Free Reflow Oven Process Control
Reflow soldering quality depends on a controlled temperature profile, stable board transport, and repeatable atmosphere inside the oven. Lyra622 focuses on these process points instead of simply adding machine length.
Stable Reflow Profile
The 3030mm heating section supports controlled ramp, soak, peak, and cooling behavior for lead-free solder paste.
Nitrogen Foundation
Lyra’s sealed process structure allows nitrogen use when oxidation control and wetting stability are required.
Compact Process Window
The 5150mm body length makes Lyra622 practical for factories that need high-end control without a larger oven footprint.
Lyra622 8 Heating Zone Reflow Oven Features
Standard Nitrogen Machine Concept
Lyra622 is designed around a nitrogen-ready structure. For Lyra622N production, nitrogen protection can support peak-zone oxygen below 500ppm, helping reduce oxidation and improve solder wetting on sensitive SMT assemblies.
- Sealed oven structure to reduce nitrogen loss
- Nitrogen process support across preheating, soldering, and cooling areas
- Suitable for high-reliability SMT soldering requirements
Stable Conveyor And Rail Transport
The conveyor system is designed for parallel, repeatable PCB movement through the process chamber. Stable transport matters because a good profile becomes unreliable if board speed, width adjustment, or rail support changes during production.
- Single rail 50-460mm standard width range
- Optional wider rail and dual-rail configuration
- 300-1800mm/min adjustable conveyor speed
Forced Convection Heating System
The Lyra622 heating chamber uses forced convection heat transfer across 8 heating zones. Six preheating zones and two peak zones give engineers enough control to build a practical lead-free reflow oven profile for common SMT boards, while the cooling zones are counted separately.
- Preheating zones up to 300°C
- Peak zones up to 350°C
- Approx. 20-minute warm-up time
Temperature Profile And Thermal Uniformity
Lyra622 supports repeatable profile control and stable heat balance across the PCB. This helps engineers reduce tombstoning, insufficient wetting, component thermal stress, and inconsistent solder joints.
- Profile support for different solder paste and PCB designs
- Designed for low temperature variation across test points
- Useful for double-sided and mixed SMT assemblies
PC And Siemens PLC Control
The control system supports clearer operation, profile management, process data storage, alarms, and production repeatability. This helps factories reduce dependence on manual experience when changing products or shifts.
- PC + Siemens PLC platform
- Chinese and English interface support
- Operation records and process data storage
Send Your Inquiry
Tell I.C.T your PCB size, capacity target, nitrogen requirement, and factory layout. The team will help confirm the right Lyra622 configuration.
Related SMT Reflow Oven Models
This Lyra page focuses on compact high-end nitrogen reflow. For different production budgets, line structures, or void-reduction requirements, compare Lyra622 with other I.C.T reflow oven series.
Factory Support And Project Service
I.C.T provides more than the reflow oven itself. The team can support SMT line layout, equipment connection, reflow profile setup, operator training, maintenance guidance, and full-line production planning.
Before shipment, Lyra equipment can be checked for heating performance, conveyor stability, control system operation, alarm function, appearance, electrical safety, and project-specific configuration. This helps customers shorten installation and startup time after delivery.
I.C.T Project Capability
From equipment design to factory startup, I.C.T keeps the project path visible so customers can confirm production quality, delivery readiness, and service support before purchase.
Equipment R&D
Engineers review process needs and machine configuration before proposal.
Equipment Production
Assembly, wiring, and component checks are completed in I.C.T workshops.
Testing And Aging
Operation, heating, alarms, and aging stability are checked before shipment.
Factory Service Delivery
On-site teams support installation, training, profile setup, and startup.
Certificate Display
Certificates and quality records support customer compliance review.
SMT Reflow Oven FAQ
Open the questions that matter for your SMT line, then send your inquiry on the right when you are ready.
What is the difference between Lyra622 and Lyra622N?
Lyra622 is the compact Lyra reflow oven platform, while Lyra622N is configured for nitrogen reflow soldering. The N model supports nitrogen process requirements such as peak-zone oxygen below 500ppm under suitable production conditions.
Is Lyra622 an 8 heating zone reflow oven?
Yes. Lyra622 has 8 heating zones: 6 preheating zones and 2 peak zones. It also has 2 cooling zones after soldering, and the heating zone length is 3030mm.
When should I choose a Nitrogen Reflow Oven?
A nitrogen reflow oven is useful when oxidation control, solder wetting, fine-pitch components, high-reliability assemblies, or stable lead-free soldering results are important. It is especially useful when the customer has clear oxygen-level or solder joint reliability requirements.
What PCB width does Lyra622 support?
The standard single rail width is 50-460mm. For buyers comparing a reflow oven 450mm width PCB requirement, Lyra622 gives enough standard rail range for 450mm-class boards. Options include 50-686mm or other custom width. Dual rail standard width is 50-290mm times 2.
Can Lyra622 be used for lead-free SMT production?
Yes. Lyra622 is designed for lead-free reflow soldering. The preheating zones support up to 300°C and the peak zones support up to 350°C, giving process engineers room to build suitable lead-free profiles.
How much nitrogen does Lyra622N use?
The PDF reference lists approx. 25m3/h for Lyra622 under single conveyor conditions below 1000ppm in the peak zone, with maximum PCB width 200mm and PCB gap 50mm. With N2-control in standby mode at 200mm transport width, the reference value is approx. 22m3/h. Actual nitrogen consumption depends on PCB width, throughput, sealing condition, and factory airflow.
Can I.C.T help set the reflow oven profile?
Yes. I.C.T can support profile setup, parameter checking, installation guidance, operator training, and process support according to the customer’s PCB, solder paste, component mix, and production target.