LV733 Vacuum Reflow Oven Machine
I.C.T LV Vacuum Series Reflow Oven
LV733 is a larger Vacuum Reflow Oven Machine for low-void SMT production, longer thermal processing, and high-reliability BGA soldering.
- Top 10 / bottom 10 heating zones with 3892mm heating length
- Ultimate vacuum 50PA with four-stage independent extraction
- PCB size support from 150 x 150mm to 400 x 400mm
- 12kW normal consumption with 12m3/min x 2 exhaust requirement
- Vacuum nitrogen reflow support with chiller configuration
LV733 Vacuum Reflow Oven Machine Technical Data
LV733 is SMT Vacuum Reflow Equipment for factories that need longer heating length, vacuum void reduction, and controlled vacuum nitrogen reflow oven capability. Use this 10-row table to check chamber size, PCB range, vacuum ability, power, cooling, and Vacuum Reflow Soldering Process conditions before project confirmation.
| Item | I.C.T LV733 |
|---|---|
| Machine dimension | 7164 × 1695 × 1630mm |
| Weight | Approx. 3500kg |
| Heating zones | Top 10 / bottom 10 controlled heating zones |
| Heating / cooling length | 3892mm heating zone length; top 3 / bottom 3 cooling zones |
| PCB size and rail width | PCB 150 × 150mm to 400 × 400mm; rail width 50-400mm |
| Ultimate vacuum | 50PA; four-stage independent vacuum extraction |
| Conveyor speed | 300-2000mm/min; three-stage independent transport |
| Temperature control | Room temperature to 300°C; PID closed loop + SSR; ±1°C precision |
| Power and consumption | 3 phase, N, PE, AC380V 50/60Hz; 83kW total; 12kW normal consumption |
| Control and exhaust | PC + Siemens PLC control; exhaust requirement 12m³/min × 2 |
Final LV733 configuration should be confirmed against board heat capacity, void-rate target, vacuum recipe, nitrogen demand, exhaust route, line direction, and site utilities.
SMT Vacuum Reflow Equipment For Low Void Soldering
LV733 is built for Vacuum Reflow Soldering Equipment projects where a longer heating section and stable vacuum extraction are needed together. It gives process teams more thermal capacity before the PCB enters the vacuum section.
Vacuum Reflow for BGA Soldering is useful when X-ray inspection shows voids in large pads, bottom-terminated components, power devices, or dense communication boards. LV733 gives the process more room to balance heating, vacuum time, and cooling.
Vacuum Reflow Soldering Process Value
LV733 combines longer hot-air reflow, independent vacuum extraction, segmented PCB transport, and cooling control. As a Vacuum Reflow Soldering System for SMT, it helps process engineers answer the practical question of How to Reduce Voids with Vacuum Reflow while keeping the line recipe repeatable.
Lower Void Risk
The vacuum stage releases trapped gas while the solder is still active, helping reduce voids before the joint cools.
Stable PCB Rhythm
Segmented movement lets heating, vacuum, and cooling timing be tuned without treating the whole oven as one transport section.
Traceable Process
The control platform records recipes, curves, alarms, and process documents so engineers can review each qualified setup.
LV733 Vacuum Reflow Oven Machine Features
Independent Vacuum Chamber For Void Reduction
The PCB enters the vacuum unit after the longer LV733 heating section. Vacuum pressure can be pulled down to the required process range, allowing pores and gases to escape from molten solder joints before cooling.
- Ultimate vacuum down to 50PA
- Four-stage independent vacuum extraction method
- Designed for BGA, power modules, and high-reliability SMT projects
Operator Software And One-Key Width Adjustment
The operator interface helps engineers store recipes, monitor process status, and adjust rail width quickly. This is useful when the same line handles multiple high-value PCB assemblies.
- Multiple programs can be stored and called
- One-key guide rail width adjustment
- Vacuum time and vacuum degree can be tuned by product
Longer Hot Air Heating Before Vacuum
LV733 gives more heating length than smaller vacuum models, supporting heavier boards and a wider thermal window before vacuum extraction. Separate top and bottom heating control helps tune the process for different board mass and solder-paste requirements.
- Top 10 / bottom 10 controlled heating zones
- 3892mm heating zone length
- Temperature control range from room temperature to 300°C
Closed-Loop Cooling And Chiller Support
The cooling section is designed for controlled post-vacuum output. Forced-air cooling is used for vacuum reflow soldering, and chiller cooling can be reviewed when the process requires vacuum nitrogen reflow conditions.
- Top 3 / bottom 3 cooling zones
- Closed-loop cooling control for process tuning
- Nitrogen confined structures, flow meters, and chiller support
Profile Monitoring For Low Void Soldering
The control software supports operation records, temperature curve measurement, process monitoring, simulation, and automatic process document storage. This helps engineers link vacuum settings with X-ray results and low-void targets.
- Temperature curve measurement and analysis
- Vacuum degree and vacuum chamber time adjustment
- Process documents saved for quality review
Send Your Inquiry
Send PCB size, component package, target void rate, solder paste, line direction, and available utilities. I.C.T will confirm whether LV733 fits your vacuum reflow soldering process.
Related Reflow Oven Models
If a Vacuum Reflow Oven Manufacturers comparison shows LV733 is more than your process needs, compare it with nitrogen, standard lead-free, and compact SMT Reflow Oven series before finalizing the line plan.
LV733 Factory Support And Project Service
For LV733 projects, I.C.T checks PCB size, void-rate target, solder paste, component height, vacuum pressure plan, cooling method, nitrogen option, exhaust points, voltage, and workshop layout before confirming the final configuration.
Before shipment, LV733 can be checked around heating ramp, pump response, chamber leak control, conveyor indexing, cooling behavior, recipe management, alarms, and selected options. This gives the project team a clearer startup path after installation.
I.C.T Project Capability
A Vacuum Reflow Oven Machine project needs careful process handling. This compact process view shows how I.C.T connects technical review, production, testing, delivery, and certificate support before LV733 enters the SMT line.
Equipment R&D
Engineers review board size, target void rate, vacuum pressure, chamber time, exhaust demand, and profile targets before the LV733 plan is fixed.
Equipment Production
Assembly focuses on the longer LV733 body, segmented rails, vacuum chamber sealing, cooling hardware, and cabinet wiring.
Testing And Aging
The team checks thermal rise, vacuum-pump response, rail movement, chamber sealing, cooling output, alarms, and recipe functions.
Factory Service Delivery
I.C.T supports packing, installation guidance, operator training, profile setup, and factory startup for LV733 projects.
Certificate Display
Quality files, certificates, and inspection records support customer supplier audits and internal approval work.
LV733 Vacuum Reflow Oven Machine FAQ
These FAQ questions focus on real buyer checks before choosing a Vacuum Reflow Oven Machine: void target, BGA reliability, PCB size, nitrogen need, cooling method, facility requirements, and maintenance.
How to Reduce Voids with Vacuum Reflow?
The direct way to reduce solder voids is to apply vacuum while solder is still molten, then cool the joint under a controlled process. LV733 moves the PCB from heating into the vacuum section, where trapped gas can leave the solder joint before solidification. The exact result depends on solder paste, pad design, component type, thermal mass, vacuum pressure, and vacuum time. Send board photos, target void rate, and current profile data so I.C.T can review whether LV733 is a suitable process route.
When should I choose Vacuum Reflow Soldering Equipment?
Choose Vacuum Reflow Soldering Equipment when void reduction, solder-joint reliability, or thermal performance matters more than the lowest equipment cost. It is commonly considered for BGA, power electronics, automotive modules, communication boards, and high-reliability assemblies. If your products pass quality checks with standard reflow, a vacuum oven may not be necessary. If X-ray inspection shows excessive voids or unstable solder joints, LV733 gives you a controlled vacuum process to test and qualify.
What PCB size can LV733 handle?
LV733 handles PCB sizes from 150 x 150mm to 400 x 400mm, with rail width from 50mm to 400mm. The real project limit should include panel size, component height, carrier design, edge clearance, and line direction. Component passing height is listed as up 25mm and down 25mm in the PDF reference. For a reliable answer, send the largest board drawing and photos of tall components before confirming the equipment configuration.
Does LV733 need nitrogen?
LV733 can be planned for standard vacuum reflow soldering, and nitrogen-related configuration can be reviewed when your process requires oxygen control or vacuum nitrogen reflow oven conditions. The PDF notes nitrogen confined structures, pipelines, nitrogen flow meters, and chillers as part of the nitrogen system configuration. Whether you need nitrogen depends on solder paste, oxidation sensitivity, product reliability target, and process validation results. Start with the soldering requirement, not the option list.
What utilities should be prepared before installation?
Prepare the electrical supply, exhaust route, floor space, compressed air, and nitrogen if required by your chosen configuration. LV733 uses 3 phase, N, PE, AC380V 50/60Hz, with 83kW total power and about 12kW normal reference consumption. The exhaust requirement is 12m3/min x 2. Before shipment, confirm conveyor height, line direction, workshop access, and unloading path so installation does not get delayed by facility issues.
How is a Vacuum Reflow Oven Machine maintained?
Maintenance should focus on rail movement, pump condition, chamber seals, exhaust flow, cooling hardware, sensors, alarms, and flux recovery. The interval depends on flux load, operating hours, solder paste, and vacuum-cycle frequency. Keep records for vacuum pressure, profile results, alarms, and cleaning work. If vacuum performance changes, inspect sealing, filters, pump status, and transport timing before changing the soldering recipe.
Send Your Inquiry