LV623 Vacuum Reflow Oven
I.C.T LV Vacuum Series Reflow Oven
LV623 is a vacuum reflow oven for low-void SMT soldering, stable vacuum control, and high-reliability PCB assembly.
- Top 8 / bottom 8 heating zones with 3110mm heating length
- Ultimate vacuum 50PA with four-stage independent extraction
- PCB size support from 150 x 150mm to 400 x 400mm
- Three-stage transport for heating, vacuum, and cooling sections
- PC + Siemens PLC control with profile and process records
LV623 Vacuum Reflow Oven Technical Data
LV623 is SMT Vacuum Reflow Equipment for factories that need vacuum void reduction, controlled heating, and stable PCB transport. Use this 10-row table to check chamber size, PCB range, vacuum ability, power, cooling, and Vacuum Reflow Soldering Process conditions before project confirmation.
| Item | I.C.T LV623 |
|---|---|
| Machine dimension | 6405 × 1695 × 1630mm |
| Weight | Approx. 3000kg |
| Heating zones | Top 8 / bottom 8 controlled heating zones |
| Heating / cooling length | 3110mm heating zone length; top 3 / bottom 3 cooling zones |
| PCB size and rail width | PCB 150 × 150mm to 400 × 400mm; rail width 50-400mm |
| Ultimate vacuum | 50PA; four-stage independent vacuum extraction |
| Conveyor speed | 300-2000mm/min; three-stage independent transport |
| Temperature control | Room temperature to 300°C; PID closed loop + SSR; ±1°C precision |
| Power and consumption | 3 phase, N, PE, AC380V 50/60Hz; 67kW total; 10kW normal consumption |
| Control and exhaust | PC + Siemens PLC control; exhaust requirement 11m³/min × 2 |
Final project configuration depends on PCB thermal mass, void target, vacuum time, nitrogen need, exhaust layout, line direction, and workshop utilities.
SMT Vacuum Reflow Equipment For Low Void Soldering
LV623 is built for Vacuum Reflow Soldering when ordinary lead-free reflow cannot meet a strict void-rate target. The PCB moves from the soldering area into the vacuum unit, where gases inside molten solder joints are extracted before the joint solidifies.
Low Void Soldering with Vacuum Reflow is useful for BGA, power modules, automotive electronics, communication boards, and other assemblies where solder-joint reliability matters more than the lowest equipment cost.
Vacuum Reflow Soldering Process Value
LV623 combines controlled hot-air reflow, segmented PCB transport, vacuum extraction, and cooling control. It helps process engineers answer the practical question of How to Reduce Voids with Vacuum Reflow while keeping the line recipe repeatable.
Lower Void Risk
The vacuum unit extracts trapped gas from molten solder joints before cooling, supporting better joint quality.
Stable PCB Rhythm
Heating, vacuum, and cooling sections are transported independently to protect timing and board position.
Traceable Process
PC + Siemens PLC control, curve analysis, alarms, and process documents support repeatable production review.
LV623 Vacuum Reflow Oven Features
Independent Vacuum Chamber For Void Reduction
The PCB enters the vacuum unit directly after soldering. Vacuum pressure can be pulled down to the required process range, allowing pores and gases to escape from molten solder joints before cooling.
- Ultimate vacuum down to 50PA
- Four-stage independent vacuum extraction method
- Suitable for BGA, power modules, and reliability projects
Three-Stage Independent PCB Transport
LV623 separates heating, vacuum, and cooling transport control. This helps the system keep the board stable during vacuum processing while each section follows its own transport logic.
- Heating, vacuum, and cooling sections adjusted independently
- Three-stage synchronous width adjustment
- Guide rail plus chain transport for 50-400mm rail range
Hot Air Heating And Stable Guide Rail Control
The heating system supports repeatable temperature curves before the board reaches the vacuum section. Separate top and bottom wind-speed control helps tune the process for different board mass and solder-paste requirements.
- Top 8 / bottom 8 controlled heating zones
- 3110mm heating zone length
- Temperature control range from room temperature to 300°C
Closed-Loop Cooling For Vacuum Reflow Output
The cooling section is designed for controlled post-vacuum cooling. Forced-air cooling is used for vacuum reflow soldering, and chiller cooling can be reviewed when the process requires vacuum nitrogen reflow conditions.
- Top 3 / bottom 3 cooling zones
- Closed-loop cooling control for process tuning
- Chiller and nitrogen configuration available for selected projects
Profile Monitoring For Low Void Soldering
The control software supports operation records, temperature curve measurement, process monitoring, simulation, and automatic process document storage. This helps engineers link vacuum settings with actual soldering results.
- Temperature curve measurement and analysis
- Vacuum degree and vacuum chamber time adjustment
- Process documents saved for quality review
Send Your Inquiry
Send PCB size, component type, target void rate, solder paste, line direction, and available utilities. I.C.T will confirm whether LV623 fits your vacuum reflow soldering process.
Related Reflow Oven Models
If LV623 is not the best process platform, compare it with nitrogen, standard lead-free, and compact SMT Reflow Oven series before finalizing the line plan.
LV623 Factory Support And Project Service
For LV623 projects, I.C.T checks PCB size, void-rate target, solder paste, component height, vacuum pressure plan, cooling method, exhaust points, voltage, and workshop layout before confirming the final configuration.
Before shipment, the machine can be reviewed around heating response, vacuum pump operation, chamber sealing, conveyor motion, cooling control, software recipes, safety alarms, and ordered options. This gives vacuum reflow oven customers a clearer startup path after installation.
I.C.T Project Capability
A vacuum reflow oven project needs careful process handling. This compact process view shows how I.C.T connects technical review, production, testing, delivery, and certificate support before LV623 enters the SMT line.
Equipment R&D
Engineers review PCB size, vacuum time, vacuum pressure, exhaust demand, and profile targets before the LV623 plan is fixed.
Equipment Production
Production follows the confirmed LV Vacuum Series structure, segmented transport, vacuum chamber, control cabinet, and delivery schedule.
Testing And Aging
Heating response, vacuum pump action, chamber sealing, conveyor motion, alarms, software functions, and profile stability are checked.
Factory Service Delivery
I.C.T supports packing, installation guidance, operator training, profile setup, and factory startup for LV623 projects.
Certificate Display
Certificate and quality files help customer teams complete supplier review and internal factory approval.
LV623 Vacuum Reflow Oven FAQ
These FAQ questions focus on real buyer checks before choosing a vacuum reflow oven: void target, vacuum process, PCB size, nitrogen need, cooling method, facility requirements, and maintenance.
How to Reduce Voids with Vacuum Reflow?
The direct way to reduce solder voids is to apply vacuum while solder is still molten, then cool the joint under a controlled process. LV623 moves the PCB from heating into the vacuum section, where trapped gas can leave the solder joint before solidification. The exact result depends on solder paste, pad design, component type, thermal mass, vacuum pressure, and vacuum time. Send board photos, target void rate, and current profile data so I.C.T can review whether LV623 is a suitable process route.
When should I choose Vacuum Reflow Soldering?
Choose Vacuum Reflow Soldering when void reduction, solder-joint reliability, or thermal performance matters more than the lowest equipment cost. It is commonly considered for BGA, power electronics, automotive modules, communication boards, and high-reliability assemblies. If your products pass quality checks with standard reflow, a vacuum oven may not be necessary. If X-ray inspection shows excessive voids or unstable solder joints, LV623 gives you a controlled vacuum process to test and qualify.
What PCB size can LV623 handle?
LV623 handles PCB sizes from 150 x 150mm to 400 x 400mm, with rail width from 50mm to 400mm. The real project limit should include panel size, component height, carrier design, edge clearance, and line direction. Component passing height is listed as up 25mm and down 25mm in the PDF reference. For a reliable answer, send the largest board drawing and photos of tall components before confirming the equipment configuration.
Does LV623 need nitrogen?
LV623 can be planned for standard vacuum reflow soldering, and nitrogen-related configuration can be reviewed when your process requires oxygen control or vacuum nitrogen reflow conditions. The PDF notes nitrogen confined structures, pipelines, nitrogen flow meters, and chillers as part of the nitrogen system configuration. Whether you need nitrogen depends on solder paste, oxidation sensitivity, product reliability target, and process validation results. Start with the soldering requirement, not the option list.
What utilities should be prepared before installation?
Prepare the electrical supply, exhaust route, floor space, compressed air and nitrogen if required by your chosen configuration. LV623 uses 3 phase, N, PE, AC380V 50/60Hz, with 67kW total power and about 10kW normal reference consumption. The exhaust requirement is 11m3/min x 2. Before shipment, confirm conveyor height, line direction, workshop access, and unloading path so installation does not get delayed by facility issues.
How is a vacuum reflow oven maintained?
Maintenance should cover the conveyor, vacuum pump, chamber sealing, exhaust path, cooling system, sensors, alarms, and flux recovery area. The interval depends on flux load, operating hours, solder paste, and how often the vacuum process runs. Keep records for vacuum pressure, profile results, alarms, and cleaning activity. If vacuum performance changes, check chamber sealing, pump condition, filters, and transport timing before changing the soldering recipe.
Send Your Inquiry