L10 10 Zone Reflow Oven
I.C.T L Series Reflow Oven
L10 is a larger L Series SMT Lead-free Reflow Oven for industrial PCB production, wider profile control, and stable output.
- 10 upper and 10 lower controlled heating zones
- 3892mm heating length for stronger profile margin
- Single rail PCB width up to 400mm, mesh width 500mm
- Chain + mesh transport with 300-2200mm/min speed range
- PLC + computer control with PID + SSR precision
10 Zone Reflow Oven Technical Data
L10 is the larger L Series PCB Reflow Oven Equipment choice for factories that need more heating length than L8 while keeping a practical industrial footprint. Use this 10-row table to check PCB width, power, transport, and reflow oven temperature profile conditions before project confirmation.
| Item | I.C.T L10 |
|---|---|
| Machine dimension | 5800 × 1200 × 1460mm |
| Weight | Approx. 2315kg |
| Heating zones | Upper 10 / bottom 10 controlled heating zones |
| Heating zone length | 3892mm |
| PCB width | Single rail 400mm max.; mesh 500mm max. |
| Conveyor speed | 300-2200mm/min |
| Temperature range | Room temperature to 300°C; control precision ±1.0°C |
| Warm-up time | Approx. 25 minutes |
| Connected / operating load | 64kW warm-up power; approx. 12kW consumption |
| Control system | PLC + computer; PID + SSR temperature control |
Final project configuration depends on voltage, line direction, exhaust layout, rail adjustment choice, center support, and customer PCB data.
SMT Reflow Oven Machine For Higher Output Lines
L10 is selected when a factory wants a lead free medium reflow soldering oven with more process length than L8, but without moving to a nitrogen or vacuum platform. The 3892mm heating section gives engineers more room to shape ramp, soak, and peak behavior.
This industrial reflow oven fits PCB assembly lines for power boards, communication products, LED modules, industrial controls, automotive subassemblies, and other products where throughput and temperature repeatability both matter.
10 Zones SMT Reflow Oven Process Value
L10 focuses on a wider lead-free process window, predictable board transport, and stable recipe management. It is a stronger standard L Series platform for factories that have outgrown a shorter oven but do not need nitrogen or vacuum soldering.
More Heating Margin
The 3892mm heating section gives process engineers more room for ramp, soak, and peak tuning.
Industrial Line Fit
The 5800mm body supports larger process capability while keeping the L Series layout practical for factory planning.
Profile Repeatability
PLC control, recipe storage, alarms, and PID + SSR temperature precision support repeatable production shifts.
L10 SMT Lead-free Reflow Oven Features
10 Heating Zones And 3892mm Heating Length
L10 gives production teams more process length than L8. The upper and lower 10-zone layout helps engineers tune a smoother lead-free temperature profile when board mass, output target, or product mix increases.
- 3892mm heating section for wider thermal margin
- Upper 10 / bottom 10 controlled heating zones
- Useful for higher-output standard SMT production
Forced Hot Air Heating System
The forced hot air heating structure helps distribute heat across the longer soldering tunnel. For lead-free production, this gives the process team more control over preheat, soak, peak, and board temperature balance.
- Upper and lower 10-zone temperature control
- 3892mm heating length for stronger process control
- Room temperature to 300°C setting range
Chain + Mesh Transport For Industrial PCBs
L10 supports chain and mesh transport so the same SMT reflow oven machine can handle different PCB panels, carriers, and production conditions. The conveyor speed range helps balance UPH with soldering profile needs.
- Single rail PCB width up to 400mm
- Mesh transport width up to 500mm
- 300-2200mm/min speed range for line tuning
Cooling And Control For Stable Output
The top forced-air cooling section and control system help protect output consistency after peak soldering. For L10, cooling and alarm review are important when the line runs longer shifts or higher product volume.
- Top 2 forced-air cooling zones
- Motor and fan cooling structure as standard
- Process data storage, alarm, and online editing support
Core Components And Serviceable Options
L10 uses practical electrical, thermal, and transport components for stable daily running. Optional automatic oil dripping and center support can be reviewed when the line has heavier boards, wider panels, or longer production shifts.
- Core components selected for routine production stability
- Optional automatic oil dripping for conveyor maintenance
- Optional center support for selected PCB conditions
Send Your Inquiry
Send PCB size, target UPH, line direction, solder paste type, and available oven space. I.C.T will confirm whether L10 gives enough profile margin for your production plan.
Related Reflow Oven Models
If L10 is not the best process platform, compare it with other SMT Reflow Oven series for nitrogen soldering, compact production, or low-void vacuum soldering.
L10 Factory Support And Project Service
For L10 projects, I.C.T checks PCB width, expected UPH, conveyor direction, exhaust points, voltage, rail adjustment, and workshop layout before confirming the final equipment plan.
Before shipment, the machine can be reviewed around heating response, conveyor motion, cooling fan operation, software recipes, safety alarms, and ordered options. This gives industrial reflow oven customers a clearer startup path after installation.
I.C.T Project Capability
A larger L Series oven needs careful project handling. This compact process view shows how I.C.T connects technical review, production, testing, delivery, and certificate support before L10 enters the SMT line.
Equipment R&D
Engineers review the 3892mm heating section, PCB width, exhaust demand, and line takt before the L10 plan is fixed.
Equipment Production
Production follows the confirmed 10-zone L Series layout, chain and mesh transport, control cabinet, and delivery schedule.
Testing And Aging
Heating response, conveyor motion, fan operation, alarms, software functions, and profile stability are checked before shipment.
Factory Service Delivery
I.C.T supports packing, installation guidance, operator training, profile setup, and factory startup for L10 projects.
Certificate Display
Certificate and quality files help customer teams complete supplier review and internal factory approval.
L10 PCB Reflow Oven FAQ
These FAQ questions focus on real buyer checks before choosing a 10-zone SMT reflow oven: zone count, line speed, lead-free profile, PCB width, running cost, installation, and maintenance.
Is a 10 zone reflow oven better than an 8 zone oven?
A 10 zone reflow oven is better when your PCB needs more profile margin, higher line speed, or smoother heating transitions than an 8-zone platform can provide. The extra process length gives engineers more room to tune ramp, soak, and peak behavior without pushing each zone too aggressively. L10 uses a 3892mm heating section, so it is a practical upgrade for medium industrial SMT production. If your boards are small and output is modest, L8 may still be enough; compare both models with real PCB size and UPH data.
How does conveyor speed affect reflow soldering quality?
Conveyor speed directly changes the time a PCB spends inside each heating zone. If speed is too fast, the board may not reach the correct soak or peak condition; if it is too slow, components and laminate can see unnecessary heat exposure. L10 supports 300-2200mm/min conveyor speed, giving engineers room to match throughput with the reflow oven temperature profile. The best setting should come from solder paste data, PCB thermal mass, and profiler measurement, not from a fixed default recipe.
What is a good lead-free reflow temperature profile?
A good lead-free reflow temperature profile follows the solder paste datasheet and is verified on the real PCB with a thermal profiler. The key values are ramp rate, soak time, peak temperature, time above liquidus, and cooling rate. L10 provides 10 upper and 10 lower heating zones with PID + SSR control, so it can support a more controlled profile than a shorter oven. For mixed products, create separate recipes for the heaviest board, the smallest board, and any carrier-based process.
What PCB size can the L10 reflow oven handle?
L10 handles standard PCB panels up to 400mm on single rail and up to 500mm on mesh transport, based on the PDF reference. The real limit should include panel width, carrier width, component clearance, and edge support. Top and bottom component clearance is listed as 25mm, so tall components or fixtures should be checked before order confirmation. Send I.C.T the maximum PCB drawing, carrier design, line direction, and upstream/downstream conveyor height so the rail and mesh plan can be confirmed correctly.
How much electricity does L10 use in production?
L10 has 64kW warm-up power and about 12kW reference operating consumption after the oven reaches stable temperature. The warm-up value is important for electrical facility planning, while the operating value is closer to daily running cost. Actual electricity use depends on recipe temperature, factory temperature, exhaust flow, production hours, and how often the oven starts from cold. For a realistic estimate, calculate cost from your shift schedule and expected utilization, then confirm power supply capacity before shipment.
What maintenance does an industrial reflow oven need?
An industrial reflow oven needs regular checks of conveyor movement, mesh or chain cleanliness, exhaust condition, fan operation, temperature alarms, and visible flux buildup. Maintenance intervals depend on solder paste, flux load, production hours, and board loading. L10 can review automatic oil dripping and center support options when the line runs heavier products or longer shifts. Keep a simple maintenance log and compare profile results over time; this helps catch fan, heating, exhaust, or conveyor issues before they affect solder quality.
Send Your Inquiry