'These machines support placing small LEDs and bare dies at high-speed as well as performing hybrid production including flip chips.
Hybrid placement of wafers and SMDs
Wafer and reel part placement in a single unit
Supports tray part and reel part placement as well as direct pickup from wafers
High accuracy placement
High rigidity construction with linear motor movement and high resolution cameras. Combines the optimum placement pressure, high accuracy, and high quality using advanced control technology.
Supports cleanroom class 1000
With the assumption that this machine is going to be used in cleanrooms, the XY robot is cleanroom capable. By setting a HEPA filter, you can achieve an even better environment for semiconductors.
Easy operation
Equipped with a large 15 inch touchscreen panel and graphical interface. The united interface controls both machine and MWU12i operation.
Covers both wafer map data management and format conversion.
※Individual user formats can be supported separately.
Fuji Ultra Accurate Placement Platform
Features
