FFlexible circuit boards (FPCs) are widely used in electronic products. Flexible circuit boards are made of polyimide or polyester film and are highly reliable flexible printed circuit boards with wiring. High density, light weight, thin thickness and good bending properties. Because FPC has low mechanical strength and is prone to cracking, it is necessary to apply reinforcing materials to strengthen the strength of FPC. The types of FPC reinforcing sheets include steel sheet, FR4, PI and aluminum foil, which solve the flexibility characteristics of FPC, improve the strength of the plugged part, and facilitate the overall assembly of the product.
FPC patching is currently available in three ways:
1. The manual method has many types of FPCs, different sizes and different types of reinforcing sheets. Therefore, the manual method is mainly used, but the manual hand sticking method is slow and the precision is poor. For the FPC with more puzzles, it can not be satisfied. Production needs.
2. Punching method The reinforcing plate can be stamped and formed by punching equipment, and the stamped and formed reinforcing plate is attached to the FPC. In order to realize the bonding process, the FPC needs to be transported to the punching device. In the prior art, the FPC needs to be placed on the transfer tray, and the transfer tray is transported to the punching device by linear motion. In order to align the FPC with the stamped and formed reinforcing plate, multiple linear movements are required to complete the alignment process. The adjustment steps are more complicated and time consuming.
3. The suction method adopts the gantry structure, and the FPC (using the jig) is transported to the placement position by rail transportation, the MARK point is positioned by the placement head, and the reinforcing piece is sucked on the automatic feeding device, and the reinforcing piece is reinforced by visual recognition. The film is compensated for precise placement. This method has high precision and fast speed, and can fully meet the needs of mass production.